Description
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Technical Parameters |
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Material categories |
Silicon sputtering target |
Molecular formula |
Si |
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CAS No |
7440-21-3 |
Purity |
99.9-99.999% |
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Molar mass |
28.085 |
Density |
2.3290 g/cm3 |
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Melting point |
1414 °C |
Boiling point |
3265 °C |
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Solubility (water) |
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Product Overview:
Silicon sputtering targets are mainly used in reactive magnetron sputtering to deposit dielectric layers such as SiO2 and SiN. As important functional thin film materials, they have good hardness, optical, dielectric properties and wear resistance.
Product Application:
As important functional thin film materials, they have good hardness, optical, dielectric properties and wear resistance. The corrosion resistance of silicon targets has broad application prospects in the field of optics and microelectronics, and is widely used as functional materials in the world. Mainly used in semiconductor chips, flat panel liquid crystal display (LCD), decoration and functional coating industry, solar panels, data storage industry (optical disc industry), optical communication industry, glass coating (architectural glass and automotive glass) industry, anti-corrosion and anti-wear (surface modification) and other fields.
