Description
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Technical Parameters |
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Material categories |
Nickel sputtering target |
Molecular formula |
Ni |
|
CAS No |
7440-02-0 |
Purity |
99.9-99.999% |
|
Molar mass |
58.692 |
Density |
6.97 g/cm3 |
|
Melting point |
1453 ℃ |
Boiling point |
2732 ℃ |
|
Solubility (water) |
Insoluble in water, ammonia, insoluble in concentrated nitric acid, soluble in dilute nitric acid, slightly soluble in hydrochloric acid and sulfuric acid |
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Product Overview:
Nickel is nearly silver-white, hard and malleable, ferromagnetic, and has good corrosion resistance.
Product Application:
Metal nickel film has good electrical conductivity, corrosion resistance, good plasticity, widely used in semiconductor and microelectronics industry, metal nickel film is often used to make MESFET device electrode key material. In industry, nickel films are often grown on heavily doped silicon substrates, and then annealed to form nickel-silicon compounds, thereby reducing the resistivity of metal-semiconductor contact and improving device performance.
