Description
|
Technical Parameters |
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Material categories |
Copper sputtering target |
Molecular formula |
Cu |
|
CAS No |
7440-50-8 |
Purity |
99.9%-99.999% |
|
Molar mass |
63.546 |
Density |
8.960g/cm³ |
|
Melting point |
1083.4℃ |
Boiling point |
2562℃ |
|
Solubility (water) |
Insoluble in water, soluble in alkali, hydrochloric acid, sulfuric acid |
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Product Overview:
We can produce various purity and requirements of 99.9%~99.9999% copper targets, can provide composition analysis certificate and other testing data according to the requirements to meet customer needs.Welcome all customers customized letter to inquire.
Product Application:
Can be used in PVD technology coating materials, a variety of single target system, multi-target sputtering system, ion sputtering system and other magnetron sputtering equipment.
It can be used in scientific experimental research, nano-processing, device manufacturing and other related products, widely used in flat display, semiconductor, solar cells, optical components, energy-saving glass and other fields.
